Substrate processing apparatus and method for removing substrate from table of substrate processing apparatus
AssigneeEbara Corporation
InventorsHaiyang XU, Koji MAEDA, Mitsuhiko INABA
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AssigneeEbara Corporation
InventorsHaiyang XU, Koji MAEDA, Mitsuhiko INABA
Estimating the term…
To detach a substrate from a table without damaging the substrate. According to Embodiment 1, provided is a substrate processing apparatus including a table to hold a substrate, a plurality of lift pins that are arranged at periphery of the table and configured to arrange or separate the substrate on or from the table and to be movable in a direction perpendicular to a surface of the table, a drive mechanism that includes a motor to move the lift pins in the direction perpendicular to the surface of the table, and a control device that is configured to control the drive mechanism. The control device is configured to be capable of moving the lift pins at a first speed and at a second speed different from the first speed.
A polishing apparatus comprising:
A method for removing a substrate supported on a table from the table, comprising:
Dependencies are inferred from the claim text.