Multi-faced molded semiconductor package and related methods

A method of forming a semiconductor package comprising:

• forming a metal layer on a first side of a wafer;
• applying a first photoresist layer on the metal layer;
• patterning the first photoresist layer;
• forming electrical contacts coupled to the metal layer using the first photoresist layer;
• removing the first photoresist layer;
• etching the metal layer;
• etching a plurality of notches into the first side of the wafer;
• applying a first mold compound into the plurality of notches, over the electrical contacts, and over the first side of the wafer;
• exposing the electrical contacts through the first mold compound through grinding the first mold compound;
• grinding a second side of the wafer opposite the first side of the wafer to the plurality of notches formed in the first side of the wafer;
• applying one of a second mold compound and a laminate resin to the second side of the wafer;
• singulating the wafer into a plurality of semiconductor packages, wherein each semiconductor package is covered by one of a first molding compound, the second molding compound, and a laminate resin on the first side, the second side, a third side, a fourth side, a fifth side, and a sixth side of each semiconductor package.