Photo-curable and heat-curable resin composition and dry film solder resist

A photo-curable and heat-curable resin composition including:

• an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in a molecule;
• a photopolymerizable monomer having at least two photo-curable unsaturated functional groups;
• a heat-curable binder having a heat-curable functional group;
• a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa);
• a dispersant;
• and
• a photo-initiator,
• wherein the plate-like inorganic filler comprises a plate-like talc powder having whiteness of 90% or higher, a particle size (D50) of 0.5 to 2 μm, a top size of 3 to 10 μm, a water content of 0.3 to 1% measured by JIS-K5101, an apparent density of 0.07 to 0.2 g/ml, and a specific surface area of 17 to 30 m2/g measured by the BET method.