Transfer film and manufacturing method thereof
AssigneeCompal Electronics, Inc.
InventorsJu-Chen Chiu, Po-An Lin, Chih-Hua Liu
Life of this patent
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AssigneeCompal Electronics, Inc.
InventorsJu-Chen Chiu, Po-An Lin, Chih-Hua Liu
Estimating the term…
A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.
A transfer film, comprising:
A manufacturing method of a transfer film, comprising:
Dependencies are inferred from the claim text.