Device and method for cleaving a substrate
AssigneeLatticeGear, LLC
InventorGal Moyal
Life of this patent
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AssigneeLatticeGear, LLC
InventorGal Moyal
Estimating the term…
A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis perpendicular to the top surface of the sample; providing a breaking pin located under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, a cleaving bar for applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin. Further, the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.
A device for cleaving a sample comprising:
A device for cleaving a sample comprising:
A device for cleaving comprising:
Dependencies are inferred from the claim text.