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US 2018/0324982 A1Published application
Joint structure between electronic component and frame
OwnerYueh-Han LIinventor
Life of this patent
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Abstract
In a joint structure between an electronic component and a frame provided in the present invention, an electronic component is disposed in a frame, and heat is conducted from the electronic component to a corresponding windward part of the frame when a bicycle moves, so that the heat can be dissipated rapidly, thereby achieving a desirable heat dissipation effect.
Claims14
A joint structure between an electronic component and a frame, comprising:
- a vehicle, having a frame and a mounting space provided on the frame, an opening being formed on the frame in a corresponding windward direction when the vehicle moves;
- a cover part, fixedly disposed on the frame, and covering at least a part of the opening;
- an electronic component, accommodated in the mounting space, and having a plate-shaped circuit board, one side surface of electronic component facing the cover part, and at least one electronic part being protrusively disposed on the other side surface, opposite the cover part, of the circuit board;
- and
- a heat conduction layer, located between the side surface of the circuit board and the cover part.
2 more elements
Dependencies are inferred from the claim text.