Heat dissipation device

Abstract

A heat dissipation device includes a flat heat conductive unit having a flat sealed chamber and a fluid flowing within the flat sealed chamber; the flat sealed chamber including a heat dissipation surface, a heat absorption surface and a peripheral surface; the heat dissipation surface being arranged opposite to the heat absorption surface and the peripheral surface being arranged between the heat dissipation surface and the heat absorption surface; a heat dissipating wall installed and standing on the heat dissipation surface and being enclosed as a receiving space; and a fan received within the receiving space. The heat dissipation device comprises a cover covering on the heat dissipating wall. The cover is a heat dissipation cover and is formed with at least one heat dissipation hole. The cover is adhered to the heat dissipating wall by using heat conducive glue. The cover further includes a fin set.

Dependencies are inferred from the claim text.