Electronic component housing package, multi-piece wiring substrate, and method for manufacturing electronic component housing package

A method for manufacturing an electronic component housing package, the method comprising:

• preparing a continuous substrate as a mother substrate, the continuous substrate including a laminate including a plurality of longitudinally and laterally arranged wiring board portions and a frame-shaped metallized layer arranged on an upper surface of the laminate, each wiring board portion having an upper surface including a mount, the frame-shaped metallized layer extending along a boundary between the wiring board portions and being convex upward in longitudinal section in a width direction;
• applying laser light to the continuous substrate through the frame-shaped metallized layer to form separation grooves in the upper surface of the laminate and to form a first sloping portion sloping inwardly from the upper surface to an inner peripheral surface;
• forming a fillet portion of a brazing material between an upper outer periphery of the frame-shaped metallized layer and a metal frame, and a filling portion that is filled with the brazing material between the first sloping portion and the metal frame, and joining the frame-shaped metallized layer to the metal frame with the brazing material;
• and
• separating the wiring board portions along the separation grooves.