Method of making printed circuit board structure including a closed cavity
AssigneeSkyworks Solutions, Inc.
InventorKi Wook Lee
Life of this patent
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Abstract
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.
Claims27
A method of making a closed cavity printed circuit board comprising:
- forming a cavity in a core structure of a core layer;
- laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity;
- forming vias through the laminate structure;
- and
- patterning the metal layers in the laminate structure.
A method of making a closed cavity printed circuit board comprising:
- providing a core layer having a core structure between a pair of metal layers;
- removing the pair of metal layers from the core layer;
- forming a cavity in the core structure;
- laminating the core structure with an adhesive layer and metal layers over a top and bottom surface of the core structure to prepare a laminate structure and cover the cavity and define a closed cavity;
- forming vias through the laminate structure;
- patterning the metal layers in the laminate structure;
- and
- attaching the patterned laminate structure to a substrate.
A method of making a printed circuit board comprising:
- providing a printed circuit board structure having an open cavity defined in a core layer;
- laying a cover layer over the printed circuit board structure so that the cover layer extends over the cavity to cover the cavity and define a closed cavity;
- laminating a board over the cover layer, the board having at least two layers;
- forming one or more through bores through the cover layer;
- and
- plating the one or more through bores to form one or more vias between a top metal layer of the board and a bottom metal layer of the board.
Dependencies are inferred from the claim text.