Resin composition and article made therefrom
AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsXiang XIONG, Zhilong HU
Life of this patent
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Abstract
Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 μm, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.
Claims18
An assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein:
- the copper foil has a thickness of less than or equal to 6 μm;
- and
- the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent.
A prepreg made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent, wherein the prepreg, after being combined with a copper foil having a thickness of less than or equal to 6 μm and cured, has a peel strength to the copper foil as measured by reference to IPC-TM-650 2.4.8 of between 3.0 lb/in and 8.0 lb/in.
A resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent, wherein the resin composition, after being at least partially cured, is combinable with a copper foil having a thickness of less than or equal to 6 μm to achieve a peel strength as measured by reference to IPC-TM-650 2.4.8 of between 4.2 lb/in and 8.0 lb/in.
Dependencies are inferred from the claim text.