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US 2018/0324955 A1Published application
No-flow adhesive for second and third level interconnects
AssigneeIntel Corporation
InventorsMohit SOOD, Huili XU, Wei TAN, Suriyakala RAMALINGAM, Jan KRAJNIAK, Nish ANANTHAKRISHNAN
Life of this patent
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Abstract
An apparatus is described. The apparatus includes a first planar board to second planar board interface. The first planar board to second planar board interface includes a reflowed solder electrical connection structure between the first and second boards and a no flow adhesive. The reflowed solder electrical connection structure includes a reflowed solder ball and a reflowed tinned pad.
Claims21
-20. (canceled)
A method, comprising:
- applying solder paste to a pad of a first planar board;
- elevating a temperature to reflow said solder paste thereby tinning said pad to form a tinned pad;
- aligning a solder ball mounted to a second planar board with said tinned pad, wherein, a no-flow adhesive exists between said first and second planar boards in the vicinity of said tinned pad and said solder ball;
- and,
- elevating a temperature to reflow said solder ball to couple said first planar board to said second planar board.
2 more elements
An apparatus, comprising:
- a first planar board to second planar board interface comprising a reflowed solder electrical connection structure between said first and second boards and a no flow adhesive, said reflowed solder electrical connection structure including a reflowed solder ball and a reflowed tinned pad.
A computing system, comprising:
- a plurality of processing cores;
- a memory controller coupled to the plurality of processing cores;
- a system memory coupled to the memory controller;
- and,
- a first planar board to second planar board interface comprising a reflowed solder electrical connection structure between said first and second boards and a no flow adhesive, said reflowed solder electrical connection structure including a reflowed solder ball and a reflowed tinned pad.
2 more elements
Dependencies are inferred from the claim text.