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US 2018/0324952 A1Published application
Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJung Hyun PARK, Yong Ho BAEK, Jae Hoon CHOI
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Abstract
There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
Claims13
A printed circuit board comprising:
- a first insulating layer;
- a first circuit pattern formed on a first surface of the first insulating layer;
- an adhesive layer provided on a second surface of the first insulating layer;
- and
- an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
2 more elements
A manufacturing method of a printed circuit board, the manufacturing method comprising:
- forming a first circuit pattern on one surface of a metal plate;
- forming a first insulating layer covering the first circuit pattern on the one surface of the metal plate;
- forming an adhesive layer on the first insulating layer;
- attaching an electronic component to the adhesive layer;
- and
- enclosing the electronic component by forming a second insulating layer on the first insulating layer.
3 more elements
Dependencies are inferred from the claim text.