Electronic assembly that includes a substrate bridge

An electronic assembly, comprising a printed circuit board;

• an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board;
• a memory module mounted to the printed circuit board such that the memory module is adjacent to the electronic package;
• and
• a substrate bridge that electrically connects the memory module to the electronic package, wherein the substrate bridge is connected to an upper surface of the substrate and an upper surface of the memory module.

An electronic assembly, comprising

• a printed circuit board;
• an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board;
• a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package;
• a second memory module mounted to the printed circuit board;
• and
• a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.

An electronic assembly, comprising:

• a printed circuit board;
• an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board;
• a memory module mounted to the printed circuit board such that the memory module is adjacent to the electronic package;
• a substrate bridge that electrically connects the memory module to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the memory module;
• and
• an electronic device mounted to an upper surface of the substrate bridge.