Circuit Board and Electronic Module with an Electrode Structure

An electronic module, comprising:

• a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface;
• and
• at least one first electronic device, disposed over the top surface of the first circuit board;
• wherein an electrode structure is disposed on the first circuit board for electrically connecting with an external circuit, wherein the electrode structure comprises a bottom surface and a side surface, wherein a second circuit board is disposed under the bottom surface of the first circuit board with the bottom surface of the first circuit board facing the top surface of the second circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the top surface of the second circuit board and extended onto said side surface of the electrode structure to form a soldering structure to electrically connect the first circuit board and the second circuit board, wherein said soldering structure comprises an outer surface that is located at a lateral side of the lateral surface of the first circuit board and above the bottom surface of the first circuit board, wherein said outer surface of the soldering structure is located outside the outmost portion of the lateral surface of the first circuit board.