Printed wiring board

A printed wiring board comprising:

• an insulating base material;
• a first conductive layer disposed on a main surface of the insulating base material in a first region and a second region defined on a plane along the main surface,
• a second conductive layer disposed on a main surface of the first conductive layer in the first region;
• and
• an insulating layer disposed on the main surface of the first conductive layer in the second region,
• wherein a ratio of a first evaluation value E1 to a second evaluation value E2 is 0.91 or more and 0.99 or less,
• wherein the first evaluation value E1 is an evaluation value of strength of a first laminated part in the first region and is obtained by Equation (1), and the second evaluation value E2 is an evaluation value of strength of a second laminated part in the second region and is obtained by Equation (2):
• E1=(Young's modulus of the insulating base material×thickness of the insulating base material)+(Young's modulus of the first conductive layer×thickness of the first conductive layer)+(Young's modulus of the second conductive layer×thickness of the second conductive layer) Equation (1);
• and
• E2=(Young's modulus of the insulating base material×thickness of the insulating base material)+(Young's modulus of the first conductive layer×thickness of the first conductive layer)+(Young's modulus of the insulating layer×thickness of the insulating layer) Equation (2).

A printed wiring board comprising:

• an insulating base material;
• a first conductive layer disposed on a main surface of the insulating base material in a first region and a second region defined on a plane along the main surface,
• a second conductive layer disposed on a main surface of the first conductive layer in the first region;
• and
• an insulating layer disposed on the main surface of the first conductive layer in the second region,
• wherein a ratio of a first evaluation value E1 to a second evaluation value E2 is 1.08 or more and 1.23 or less and a difference in thicknesses of the first conductive layer and the second conductive layer is 0.00 [μm] or more and 2.94 [μm] or less,
• wherein the first evaluation value E1 is an evaluation value of strength of a first laminated part in the first region and is obtained by Equation (1) and the second evaluation value E2 is an evaluation value of strength of a second laminated part in the second region and is obtained by Equation (2):
• E1=(Young's modulus of the insulating base material×thickness of the insulating base material)+(Young's modulus of the first conductive layer×thickness of the first conductive layer)+(Young's modulus of the second conductive layer×thickness of the second conductive layer) Equation (1);
• and
• E2=(Young's modulus of the insulating base material×thickness of the insulating base material)+(Young's modulus of the first conductive layer×thickness of the first conductive layer)+(Young's modulus of the insulating layer×thickness of the insulating layer) Equation (2).