Systems and methods for providing electromagnetic interference (emi) compartment shielding for components disposed inside of system electronic packages

A system module package comprising:

• a substrate;
• circuitry comprising at least one electrical component mounted over a surface of the substrate;
• a common electrical ground structure disposed on the surface of the substrate, the common electrical ground structure having at least first and second portions;
• and
• a compartment electromagnetic interference (EMI) shield, the compartment EMI shield surrounding and extending over at least one portion of the circuitry, the compartment EMI shield comprising at least a first set of bond wires, each wire having a first length that extends over and is spaced apart from said at least one electrical component and having second and third lengths that extend from opposite ends of the respective first length and connect to the common electrical ground structure, the first lengths being substantially parallel to one another and being substantially parallel to a plane in which the surface of the substrate lies, the compartment EMI shield attenuating a frequency or frequency range of interest.