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US 2018/0324510 A1Published application
Mems multi-module assembly, manufacturing method and electronics apparatus
AssigneeGoertek Inc.
InventorQuanbo Zou
Life of this patent
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Abstract
A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.
Claims22
1-21. (canceled)
A MEMS multi-module assembly, comprising:
- a first die having a first hole;
- and
- a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.
A method for manufacturing a MEMS multi-module assembly, comprising:
- forming a first wafer, wherein the first wafer has at least one first MEMS device and has at least one first hole;
- forming a second wafer, wherein the second wafer has at least one second MEMS device;
- stacking the second wafer onto the first wafer, wherein the second MEMS device is connected outside via the first hole;
- and
- singulating the wafers at a wafer level, to form a MEMS multi-module assembly, wherein each wafer is singulated into at least one dies.
2 more elements
Dependencies are inferred from the claim text.