Solid-state image pickup device, manufacturing method therefor, and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorKenichi MURATA
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Semiconductor Solutions Corporation
InventorKenichi MURATA
Estimating the term…
The present disclosure relates to a solid-state image pickup device, a manufacturing method therefor, and an electronic apparatus that further miniaturization of a solid-state image pickup device to be achieved. A lower electrode is provided in each of pixels so as to hold a photoelectric conversion film including an organic material between the lower electrode and an upper electrode, and an isolation region is disposed to isolate the lower electrodes of the pixels from each other and includes at least a fixed charge film. The isolation region is formed by the fixed charge film that is formed more deeply than the thickness of the lower electrode. The present technology is, for example, applicable to a solid-state image pickup device having an organic photoelectric conversion film.
A solid-state image pickup device comprising:
A method for manufacturing a solid-state image pickup device, comprising the steps of:
An electronic apparatus comprising:
Dependencies are inferred from the claim text.