Modem and rf chips, application processor including the same and operating method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsJUN-HO HUH, HO-RANG JANG, SEOK-CHAN KIM, IN-TAE KANG, SANG-HEON LEE, KWAN-YEOB CHAE, JUNE-HEE LEE, SANG-HUNE PARK, JAE-CHOL LEE, HYUNG-KWEON LEE
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