Laser beam generation apparatus, laser machining device, and laser machining method

12:

• The laser beam generation apparatus according to claim 11, wherein the optical amplification section comprises a plurality of optical amplifiers which are connected in series.

13:

• The laser beam generation apparatus according to claim 11, wherein the light source section comprises a plurality of surface emitting lasers which are arrayed in a two-dimensional formation on a surface perpendicular to a direction of an optical axis of the laser light.

14:

• The laser beam generation apparatus according to claim 11, wherein the control unit is configured to control the seed lasers of the light source section to perform pulsed oscillation independent of each other.

15:

• The laser beam generation apparatus according to claim 11, wherein the control unit is configured to control at least one of the seed lasers of the light source section to perform continuous oscillation, and configured to control other seed lasers to perform pulsed oscillation.

16:

• The laser beam generation apparatus according to claim 11, wherein the optical amplification section comprises an optical fiber amplifier.

17:

• The laser beam generation apparatus according to claim 14, wherein the control unit is configured to set up a pulse width of each of the seed lasers which are controlled to perform pulsed oscillation.

18:

• The laser beam generation apparatus according to claim 14, wherein the control unit is configured to set up a pulse height value of each of the seed lasers which are controlled to perform pulsed oscillation.

19:

• The laser beam generation apparatus according to claim 14, wherein the control unit is configured to set up a pulse delay of each of the seed lasers controlled to perform pulsed oscillation, by bringing the pulse delay forward or backward from an arbitrary reference time.

20:

• The laser beam generation apparatus according to claim 11, wherein the laser light emitted by each of the seed lasers is of single mode output type.

22:

• The laser machining device according to claim 21, wherein the control unit is configured to control the seed lasers of the light source section to perform pulsed oscillation independently of each other.

23:

• The laser machining device according to claim 21, wherein the control unit is configured to control at least one of the seed lasers of the light source section to perform continuous oscillation, and configured to control other laser beams to perform pulsed oscillation.

25:

• The laser machining method according to claim 24, wherein at least one of the seed lasers is controlled to perform continuous oscillation, and other seed lasers are controlled to perform the pulsed oscillation, and
• the combining includes combining the laser light emitted by the other seed lasers and laser light emitted by the at least one of the seed lasers.