Miniaturized electronics package with patterned thin film solid state battery
AssigneeInternational Business Machines Corporation
InventorsQianwen Chen, Bing Dang, John U. Knickerbocker
Life of this patent
Estimating the term…
Abstract
A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.
Claims15
A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
- a thin film microbattery formed over a release layer of a handler, wherein subsequent to formation, the thin film microbattery is removed from the handier and deposited onto an interposer;
- electronic circuitry formed on the interposer;
- and
- a seal formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules.
A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
- a thin film microbattery formed directly on an interposer;
- electronic circuitry formed directly on the interposer after complete formation of the thin-film microbattery;
- and
- a seal formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules.
15-20. (canceled)
Dependencies are inferred from the claim text.