Method for manufacturing organic electronic device and method for manufacturing sealing member
AssigneeSumitomo Chemical Company, Limited
InventorsMasato SHAKUTSUI, Masaya SHIMOGAWARA, Shinichi MORISHIMA
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Abstract
According to a method for manufacturing an organic electronic device, a sealing member (19) that includes a sealing substrate (15), an adhesive part (13) exhibiting adhesiveness and is provided on the sealing substrate (15), and a hygroscopic part (11) being a hygroscopic cured product provided on the adhesive part (13) is bonded to an organic electronic element (17).
Claims10
A method for manufacturing an organic electronic device in which an organic electronic element is formed on a support substrate, the method comprising:
- a sealing member forming step of forming a sealing member that includes a sealing substrate, an adhesive part exhibiting adhesiveness and is formed on the sealing substrate, and a hygroscopic part being a hygroscopic cured product formed on the adhesive part;
- and
- a sealing step of bonding the sealing member to the organic electronic element.
A method for manufacturing a sealing member that seals an organic electronic element formed on a support substrate, the method comprising:
- an adhesive part forming step of forming an adhesive part having an adhesive property on a sealing substrate;
- and
- a hygroscopic part forming step of forming a hygroscopic part being a hygroscopic cured product on the adhesive part.
Dependencies are inferred from the claim text.