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US 2018/0323369 A1Published application
Inductors with through-substrate via cores
AssigneeMicron Technology, Inc.
InventorKyle K. Kirby
Life of this patent
Estimating the term…
Abstract
A semiconductor device comprising a substrate is provided. The device further comprises a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor disposed around the TSV. The substantially helical conductor can be configured to generate a magnetic field in the TSV in response to a current passing through the helical conductor. More than one TSV can be included, and/or more than one substantially helical conductor can be provided.
Claims34
A semiconductor device, comprising:
- a substrate,
- a through-substrate via (TSV) extending into the substrate, and
- a substantially helical conductor disposed around the TSV.
A semiconductor device, comprising:
- a substrate,
- a through-substrate via (TSV) extending into the substrate,
- a first substantially helical conductor disposed around the TSV, and
- a second substantially helical conductor disposed around the TSV.
1 more element
A semiconductor device, comprising:
- a substrate,
- a first through-substrate via (TSV) extending into the substrate,
- a second TSV extending into the substrate,
- a first substantially helical conductor disposed around the first TSV, and
- a second substantially helical conductor disposed around the second TSV.
2 more elements
A semiconductor device, comprising:
- a substrate,
- a through-substrate via (TSV) extending into the substrate, and
- a non-planar spiral conductor disposed around the TSV.
Dependencies are inferred from the claim text.