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US 2018/0323361 A1Published application
Thermoelectric device embedded in a printed circuit board
AssigneeTexas Instruments Incorporated
InventorsHenry L. Edwards, Kenneth J. Maggio, Steven Kummerl, Sreenivasan K. Koduri
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Abstract
A circuit board includes an embedded thermoelectric device with hard thermal bonds. A method includes embedding a thermoelectric device in a circuit board and forming hard thermal bonds.
Claims10
A method of embedding an integrated thermoelectric device in a circuit board, the method comprising:
- placing the integrated thermoelectric device onto die attach epoxy on a first resin coated copper film;
- adding a layer of partially cured epoxy resin over the integrated thermoelectric device;
- placing a second resin coated copper film over the layer of partially cured epoxy resin;
- hot pressure laminating the first resin coated copper film, the integrated thermoelectric device, the layer of partially cured epoxy resin and the second resin coated copper film to form the circuit board with the integrated thermoelectric device embedded;
- laser drilling openings in a front side and a back side of the circuit board to metal pads on the integrated thermoelectric device;
- forming metal layers on the front side and the back side of the circuit board which at least partially fill the openings;
- patterning and etching the metal layers on the front side and the back side of the circuit board to form electrical and thermal traces;
- and
- forming a hard thermal bond between the thermal trace and a heat source or a heat sink.
6 more elements
Dependencies are inferred from the claim text.