Condensation reaction-type die bonding agent, led light emitting device and method for manufacturing same

A method for manufacturing an LED light emitting device comprising the steps of:

• using a die bonding agent to bond an LED device provided on its surface with device electrodes having connection surfaces covered by gold to a surface of a mounting substrate having substrate electrodes;
• connecting said substrate electrodes and said connection surfaces of said device electrodes by conductive interconnect members;
• and
• sealing said LED device by a sealing member, wherein
• said die bonding agent is a condensation reaction type bonding agent comprising:
• (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups,
• (B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and
• (C) a condensation reaction catalyst.

An LED light emitting device comprising:

• a mounting substrate having substrate electrodes;
• an LED device provided on its surface with device electrodes having connection surfaces covered with gold;
• a bonding member for bonding a front surface of said mounting substrate and a back surface of said LED device;
• conductive interconnect members with one ends connected to said substrate electrodes and with other ends connected to the connection surfaces of said device electrodes;
• and
• a sealing member for sealing said LED device, wherein
• said bonding member is obtained by a condensation reaction of
• (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups,
• (B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and
• (C) a condensation reaction catalyst.