Uv led package

An ultra-violet (UV) light emitting diode (LED) package comprising:

• a submount comprising a first reflective electrode film and a second reflective electrode film separated from the first reflective electrode film by an electrode separation gap on a heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film;
• a UV LED chip emits ultraviolet light in a wavelength range from 200 nm to 400 nm, the UV LED chip comprising a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad;
• and
• a package body comprising a first metal body and a second metal separated from the first metal body by an insulating material and the first metal body electrically connected to the first wire bonding pad through a first bonding wire and the second metal body electrically connected to the second wire bonding pad through a second bonding wire,
• wherein the UV LED chip positioned substantially a center of the submount and covered at least a part of the first reflective electrode film, the second reflective electrode film and the electrode separation gap.

An ultra-violet (UV) light emitting diode (LED) package comprising:

• a submount comprising a first reflective electrode film and a second reflective electrode film separated from the first reflective electrode film by an electrode separation gap on a heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film;
• a UV LED chip emits ultraviolet light in a wavelength range from 200 nm to 400 nm, the UV LED chip comprising a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad;
• and
• a package body comprising a first metal body and a second metal separated from the first metal body by an insulating material and the first metal body electrically connected to the first wire bonding pad through a first bonding wire and the second metal body electrically connected to the second wire bonding pad through a second bonding wire,
• wherein the submount is formed a quadrangle with four corners and the second reflective electrode film is formed a quadrangular in one corner of the submount, the first reflective electrode film is formed an L-shape in three corners of the submount.

An ultra-violet (UV) light emitting diode (LED) package comprising:

• a submount comprising a first reflective electrode film and a second reflective electrode film separated from the first reflective electrode film by an electrode separation gap, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film;
• a UV LED chip comprising a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad, and flip-chip bonded to the submount;
• and
• a package body mounted on the submount and comprising a first metal body electrically connected to the first wire bonding pad through a first bonding wire and a second metal body separated from the first metal body by an insulating material and electrically connected to the second wire bonding pad through a second bonding wire,
• wherein the submount is in the form of a quadrangle with four corners and the first wire bonding pad, the second wire bonding pad, the first flip-chip bonding pad and the second flip-chip bonding pad are arranged separately on one diagonal line connecting the diagonal corners of the submount.