Fabrication of wrap-around and conducting metal oxide contacts for igzo non-planar devices
AssigneeIntel Corporation
InventorsVan H. LE, Rafael RIOS, Gilbert DEWEY, Jack T. KAVALIEROS, Marko RADOSAVLJEVIC
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AssigneeIntel Corporation
InventorsVan H. LE, Rafael RIOS, Gilbert DEWEY, Jack T. KAVALIEROS, Marko RADOSAVLJEVIC
Estimating the term…
Embodiments of the invention include non-planar InGaZnO (IGZO) transistors and methods of forming such devices. In an embodiment, the IGZO transistor may include a substrate and an IGZO fin formed above the substrate. Embodiments may include a source contact and a drain contact that are formed adjacent to more than one surface of the IGZO fin. Additionally, embodiments may include a gate electrode formed between the source contact and the drain contact. The gate electrode may be separated from the IGZO layer by a gate dielectric. In one embodiment, the IGZO transistor is a fmfet transistor. In another embodiment the IGZO transistor is a nanowire or a nanoribbon transistor. Embodiments of the invention may also include a non-planar IGZO transistor that is formed in the back end of line stack (BEOL) of an integrated circuit chip.
A semiconductor device, comprising:
A method of forming a non-planar InGaZnO (IGZO) transistor, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.