Silicon carbide semiconductor device and method for producing same
AssigneeDenso Corporation
InventorsJun KAWAI, Kazuhiko SUGIURA, Yasuji KIMOTO, Kayo KONDO
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AssigneeDenso Corporation
InventorsJun KAWAI, Kazuhiko SUGIURA, Yasuji KIMOTO, Kayo KONDO
Estimating the term…
A silicon carbide semiconductor device includes: a semiconductor substrate that has a front surface and a rear surface, and is made of silicon carbide; and an ohmic electrode that is ohmically connected to the front surface or the rear surface of the semiconductor substrate. The ohmic electrode includes a metal silicide part and a metal carbide part. The metal silicide part surrounds a periphery of the metal carbide part that has a block shape. The metal silicide part is disposed between the semiconductor substrate and the metal carbide part.
A silicon carbide semiconductor device comprising:
A method for producing a silicon carbide semiconductor device which is provided with an ohmic electrode ohmically connected to a front surface or a rear surface of a semiconductor substrate that has the front surface and the rear surface, and is made of silicon carbide, the method comprising:
Dependencies are inferred from the claim text.