Back to results
US 2018/0323253 A1Published application
Semiconductor devices with through-substrate coils for wireless signal and power coupling
AssigneeMicron Technology, Inc.
InventorKyle K. Kirby
Life of this patent
Estimating the term…
Abstract
A semiconductor device comprising a substrate and a substantially spiral-shaped conductor is provided. The substantially spiral-shaped conductor extends substantially into the substrate and has a spiral axis substantially perpendicular to a surface of the substrate. The substantially spiral-shaped conductor can be configured to be wirelessly coupled to another substantially spiral-shaped conductor in another semiconductor device.
Claims20
A semiconductor device, comprising:
- a substrate having a front side and a back side;
- a plurality of circuit elements on the front side of the substrate;
- and
- a spiral-shaped conductor extending downward from the front side of the substrate into the substrate and having a spiral axis perpendicular to the front side of the substrate,
- wherein opposite ends of the spiral-shaped conductor are electrically connected to at least one of the plurality of circuit elements.
2 more elements
(canceled)
A semiconductor package, comprising:
- a first die including:
- a first substrate having a front side and a back side,
- a first plurality of circuit elements on the front side of the first substrate, and
- a first spiral-shaped conductor extending downward from the front side of the first substrate into the first substrate and having a spiral axis perpendicular to the front side of the first substrate;
- and
- a second die including:
- a second substrate having a front side and a back side,
- a second plurality of circuit elements on the front side of the second substrate, and
- a second spiral-shaped conductor,
- wherein the first spirally-shaped conductor and the second spirally-shaped conductor are wirelessly coupled.
7 more elements
A semiconductor package, comprising:
- a plurality of dies arranged in a stack, each die including a substrate, a plurality of circuit elements on a front side of the substrate, and a spiral-shaped conductor having a spiral axis perpendicular to a surface of the substrate,
- wherein adjacent dies of the plurality of dies are wirelessly coupled by the respective spiral-shaped conductors thereof, and
- wherein the spiral-shaped conductor of a first die of the plurality of dies extends downward from the front side of the substrate of the first die into the substrate thereof of the first die.
Dependencies are inferred from the claim text.