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US 2018/0323236 A1Published application
Highly reliable light emitting diode
AssigneeSeoul Viosys Co., Ltd.
InventorsSe Hee Oh, Jong Kyu Kim, Hyun A Kim
Life of this patent
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Abstract
Disclosed herein is a highly reliable light emitting diode. In the light emitting diode, a connector connecting light emitting cells to each other is spaced apart from bump pads in a lateral direction so as not to overlap each other. Accordingly, it is possible to provide a chip-scale flip-chip type light emitting diode having good properties in terms of heat dissipation performance and electrical reliability.
Claims20
A light emitting diode device comprising:
- an array of light emitting cells including a plurality of light emitting cells arranged in series in a flow direction of an electrical current flowing through the plurality of light emitting cells, each light emitting cell including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer;
- an ohmic reflection layer disposed on the second conductivity type semiconductor layer of each of the light emitting cells to form ohmic contact with the second conductivity type semiconductor layer;
- a lower insulation layer covering the light emitting cells and the ohmic reflection layer, the lower insulation layer having first openings exposing the first conductivity type semiconductor layer of each of the light emitting cells and second openings exposing the ohmic reflection layer of each of the light emitting cells;
- a connector disposed on the lower insulation layer and electrically connecting adjacent light emitting cells to each other;
- a first pad metal layer electrically connected to the first conductivity type semiconductor layer of one of the light emitting cells disposed last in the flow direction through the first openings of the lower insulation layer;
- a second pad metal layer electrically connected to the ohmic reflection layer of another of the light emitting cells disposed first in the flow direction through the second openings of the lower insulation layer;
- an upper insulation layer covering the connector and the first and second pad metal layers, the upper insulation layer having a third opening and a fourth opening exposing upper surfaces of the first and second pad metal layers, respectively;
- and
- a first bump pad and a second bump pad that are respectively connected to the upper surfaces of the first pad metal layer and the second pad metal layer exposed through the third and fourth openings,
- wherein the connector is spaced apart from the first and second bump pads along a direction without overlapping the first and second bump pads.
7 more elements
A light emitting diode device comprising:
- an array of light emitting cells including a plurality of light emitting cells arranged in series in a flow direction of an electrical current flowing through the plurality of light emitting cells, each light emitting cell including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer;
- a lower insulation layer covering the light emitting cells and having openings on each of the light emitting cells;
- a connector disposed on the lower insulation layer and electrically connecting adjacent light emitting cells to each other;
- a first pad metal layer electrically connected to the first conductivity type semiconductor layer of one of the light emitting cells disposed last in the flow direction through some of the openings of the lower insulation layer;
- a second pad metal layer electrically connected to the second conductivity type semiconductor layer of another of the light emitting cells disposed first in the flow direction through the others of the openings of the lower insulation layer;
- an upper insulation layer covering the connector and the first and second pad metal layers, the upper insulation layer having openings exposing upper surfaces of the first and second pad metal layers, respectively;
- and
- a first bump pad and a second bump pad that are respectively connected to the upper surfaces of the first pad metal layer and the second pad metal layer exposed through the openings of the upper insulation layer,
- wherein the connector is spaced apart from the first and second bump pads in a direction without overlapping the first and second bump pads.
6 more elements
A light emitting diode device comprising:
- an array of light emitting cells including a plurality of light emitting cells arranged in series in a flow direction of an electrical current flowing through the plurality of light emitting cells, each light emitting cell including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer;
- a lower insulation layer covering the light emitting cells and having a plurality of openings on each of the light emitting cells;
- a connector disposed on the lower insulation layer and electrically connecting adjacent light emitting cells to each other;
- at least one floating metal layer disposed on the lower insulation layer and spaced apart from the connector;
- an upper insulation layer covering the connector and the at least one floating metal layer;
- a first bump pad disposed on the upper insulation layer and electrically connected to the first conductivity type semiconductor layer of one of the plurality of light emitting cells;
- and
- a second bump pad disposed on the upper insulation layer and electrically connected to the second conductivity type semiconductor layer of another light emitting cell of the plurality of light emitting cells,
- wherein the connector is spaced apart from the first and second bump pads in a direction without overlapping the first and second bump pads, and the at least one floating metal layer comprises a floating metal layer at least partially overlapping one of the first and second bump pads.
6 more elements
Dependencies are inferred from the claim text.