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US 2018/0323176 A1Published application
Semiconductor apparatus and semiconductor system including the same
AssigneeSK hynix Inc.
InventorKwan Dong KIM
Life of this patent
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Abstract
A semiconductor apparatus may include a package substrate, and a plurality of semiconductor chips. Wherein the package substrate and the semiconductor chips may be configured based on a load value of the semiconductor apparatus.
Claims18
A semiconductor apparatus comprising:
- a package substrate;
- and
- a semiconductor chip, wherein the package substrate comprises a substrate pad coupled with a package ball, wherein the semiconductor chip comprises:
- a main pad coupled with the substrate pad;
- a first buffer coupled with the main pad;
- and
- an auxiliary pad coupled with the first buffer.
4 more elements
The semiconductor apparatus according to claim wherein the main pad is coupled with the substrate pad through a through electrode, and the main pad and the auxiliary pad are not coupled directly with each other.
The semiconductor apparatus according to claim further comprising:
- a second buffer coupled with the first buffer, the auxiliary pad and an internal circuit of the semiconductor chip.
A semiconductor apparatus comprising:
- a package substrate;
- and
- a first semiconductor chip and a second semiconductor chip stacked with the package substrate, wherein the package substrate comprises a substrate pad coupled with a package ball, wherein the first semiconductor chip comprises:
- a first main pad coupled with the substrate pad;
- a first buffer coupled with the first main pad;
- a first auxiliary pad coupled with the first buffer;
- and
- a second buffer coupled with the first buffer and the first auxiliary pad, and wherein the second semiconductor chip comprises:
- a second auxiliary pad coupled with the first auxiliary pad.
6 more elements
A semiconductor apparatus comprising:
- a package substrate;
- and
- a first semiconductor chip stacked over the package substrate, wherein the package substrate comprises:
- a substrate pad which is coupled with a package ball, and wherein the first semiconductor chip comprises:
- a main pad coupled with the substrate pad;
- an auxiliary pad;
- and
- a buffer configured to couple the main pad and the auxiliary pad.
5 more elements
Dependencies are inferred from the claim text.