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US 2018/0323175 A1Published application
Semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
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Abstract
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
Claims16
A heat transfer label structure, comprising:
- a heat conduction layer;
- and
- a label layer on the heat conduction layer,
- wherein the label layer comprises:
- a facestock layer on a first surface of the heat conduction layer;
- a first ink pattern having a first color on the facestock layer;
- and
- a second ink pattern having a second color on the facestock layer, the second ink pattern disposed on a side of the first ink pattern.
5 more elements
A heat transfer label structure, comprising:
- a label layer comprising a facestock layer and ink patterns on the facestock layer;
- a heat conduction layer being formed of copper and having a thickness of between 25 micrometer and 50 micrometer;
- and
- an adhesion film between the heat conduction layer and the facestock layer,
- wherein the heat conduction layer have higher thermal conductivity than that of the label layer.
2 more elements
Dependencies are inferred from the claim text.