Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines

A method of operating a wire bonding machine, the method comprising the steps of:

• (a) supporting a substrate on a material handling system of the wire bonding machine;
• (b) moving a clamping element of the wire bonding machine to be in contact with the substrate prior to contact between the substrate and a support structure of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, the contact between the clamping element and the substrate changing a bend profile of the substrate;
• and
• (c) securing, after step (b), the substrate against the support structure using the clamping element of the wire bonding machine, the clamping element for securing the substrate to the support structure during the wire bonding operation.

A method of operating a wire bonding machine, the method comprising the steps of:

• (a) supporting a substrate on a material handling system of the wire bonding machine;
• (b) moving a support structure of the wire bonding machine to be in contact with the substrate prior to contact between the substrate and a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, the contact between the support structure and the substrate changing a bend profile of the substrate;
• and
• (c) securing, after step (b), the substrate against the support structure using the clamping element of the wire bonding machine, the clamping element for securing the substrate to the support structure during the wire bonding operation.

A method of operating a wire bonding machine, the method comprising the steps of:

• (a) supporting a substrate on a material handling system of the wire bonding machine;
• (b) changing a bend profile of the substrate using a fluid system of the wire bonding machine, the fluid system being configured to direct a fluid to change the bend profile of the substrate;
• and
• (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.

A wire bonding machine comprising:

• a bond head assembly including a wire bonding tool for bonding a portion of wire to a substrate at a bonding area of the wire bonding machine;
• a material handling system for providing the substrate to the bonding area;
• a support structure for supporting the substrate during a wire bonding operation;
• a clamping element for securing the substrate to the support structure during the wire bonding operation;
• and
• a fluid system configured to direct a fluid to change a bend profile of the substrate.