Semiconductor device and method for manufacturing same

A semiconductor device, which has a mountain-shaped wire loop with a predetermined height that connects between a first position on a substrate to a second position on the substrate spaced apart from the first position by a first distance, comprising:

• a first junction, which is formed by bonding a wire at the first position by a capillary;
• a top, which is formed, after forming the first junction, by lifting the capillary up to a first height while feeding the wire from the capillary, then carrying out a circular arc motion for moving the capillary in a circular arc from the first position toward a direction of a second position, then carrying out a lifting motion for lifting the capillary while feeding the wire from the capillary, then moving the capillary in a circular arc toward the direction of the first position by a second distance longer than the first distance, then lifting the capillary up to a second height higher than the first height while feeding the wire from the capillary, and then looping the capillary to a second position;
• and
• a second junction, which is formed by bonding the wire to the second position.