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US 2018/0323164 A1Published application
Semi-conductor package structure
AssigneeIntel Corporation
InventorXinhua Wang
Life of this patent
Estimating the term…
Abstract
Disclosed is a semiconductor package structure comprising a body, a plurality of first-layer, second-layer, third-layer and fourth-layer electrical contacts, wherein the first-layer, the second-layer, the third-layer and the fourth-layer electrical contacts are arranged sequentially from outside, to inside on a bottom surface of the body in a matrix manner. Adjacent first-layer electrical contacts have two different spacings therein, and adjacent third-layer electrical contacts have the two different spacings therein.
Claims18
A semiconductor device, comprising:
- a semiconductor chip mounted to a package body;
- a number of contacts located on the package body, the number of contacts electrically connected to the semiconductor chip, the number of contacts arranged in an array, array including:
- a first layer, wherein the first layer includes contacts with a first spacing, and one or more gaps between contacts having a first layer gap spacing greater than the first spacing;
- a second layer inside the first layer, wherein the second layer includes contacts with only the first spacing;
- and
- a third layer inside the second layer, wherein the third layer includes contacts with the first spacing, and one or more gaps between contacts having a third layer gap spacing greater than the first spacing.
3 more elements
A semiconductor device, comprising:
- a semiconductor chip mounted to a package body;
- a number of contacts located on the package body, the giber of contacts electrically connected to the semiconductor chip, the number of contacts arranged in an array, the array including:
- a first layer, wherein the first layer includes contacts with a first spacing, and one or more gaps between contacts having a first layer gap spacing greater than the first spacing;
- a second layer inside the first layer, wherein the second layer includes contacts with only the first spacing;
- a third layer inside the second layer, wherein the third layer includes contacts with the first spacing, and one or more gaps between contacts having a third layer gap spacing greater than the first spacing;
- and
- a fourth layer including contacts having only the first spacing.
4 more elements
Dependencies are inferred from the claim text.