Back to results
US 2018/0323161 A1Published application
Semiconductor device and method of manufacturing thereof
AssigneeAmkor Technology, Inc.
InventorsGreg Hames, Glenn Rinne, Devarajan Balaraman
Life of this patent
Estimating the term…
Abstract
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.
Claims21
1-20. (canceled)
An electronic device comprising:
- a bond pad;
- and
- a conductive pillar on the bond pad, the conductive pillar comprising:
- an inner pillar core comprising a top core surface, a bottom core surface, and a lateral core surface between the top core surface and the bottom core surface;
- a seed layer that laterally surrounds the inner pillar core;
- and
- an outer plated metal that laterally surrounds the seed layer,
- wherein at least a portion of the top core surface is exposed from the seed layer.
5 more elements
An electronic device comprising:
- a bond pad;
- and
- a conductive pillar on the bond pad, the conductive pillar comprising:
- an inner pillar core comprising a top core surface, a bottom core surface, and a lateral core surface between the top core surface and the bottom core surface;
- a seed layer that laterally surrounds the inner pillar core;
- and
- an outer plated metal that laterally surrounds the seed layer,
- wherein a top surface of the outer plated metal is coplanar with the top core surface.
5 more elements
An electronic device comprising:
- a bond pad;
- and
- a conductive pillar on the bond pad, the conductive pillar comprising:
- a base seed layer;
- an inner pillar core plated on the base seed layer, the inner pillar core comprising a top core surface, a bottom core surface, and a lateral core surface between the top core surface and the bottom core surface;
- at least one horizontal seed layer on base seed layer and laterally surrounding a bottom end of the inner pillar core;
- at least two vertical seed layers laterally surrounding the inner pillar core;
- and
- an outer plated metal that laterally surrounds the at least two vertical seed layers,
- wherein the at least two vertical seed layers outnumber the at least one horizontal seed layer.
7 more elements
Dependencies are inferred from the claim text.