Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package

A microelectronic device comprising:

• a first overmolded component that includes a first die having a silicon based substrate;
• a second overmolded component that includes a second die that is coupled to the first die;
• the second die being formed with compound semiconductor materials in a different substrate;
• and
• a substrate coupled to at least one of the first die and the second die, the substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 15 GHz or higher.

A computing device comprising:

• at least one processor to process data;
• and
• a communication module or chip coupled to the at least one processor, the communication module or chip comprises,
• a first overmolded component that includes a first die having a silicon based substrate;
• a second overmolded component that includes a second die that is coupled to the first die;
• the second die being formed with compound semiconductor materials;
• and
• a substrate coupled to at least one of the first die and the second die, the substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 15 GHz or higher.