US 2018/0323158 A1 · MAGNETIC INDUCTOR STACK INCLUDING INSULATING MATERIAL HAVING MULTIPLE THICKNESSES

Abstract

Provided is an inductor structure. In embodiments of the invention, the inductor structure includes a laminated first stack and a laminated second stack. The laminated first stack includes one or more layers of a magnetic material and one or more layers of a first insulating material having a thickness. The inductor structure also includes at least one layer of a second insulating material having a thickness. The thickness of the at least one layer of the second insulating material is different than the thickness of each of the layers of the first insulating material.

Claims20

Dependent claims

An inductor structure for use in a semiconductor device, comprising:

a laminated first stack including:
one or more layers of a magnetic material;
and
one or more layers of a first insulating material having a thickness, wherein the layers of magnetic material alternate with the first layers of insulating material;
and
at least one layer of a second insulating material having a thickness;
wherein:
the thickness of the at least one layer of the second insulating material is different than the thickness of each of the layers of the first insulating material.

5 more elements

A method of forming an inductor structure for use in a semiconductor device, comprising:

forming a first laminated first stack including:
depositing one or more layers of magnetic material;
and
depositing one or more layers of a first insulating material having a first thickness, wherein the layers of magnetic material are deposited in an alternating manner with the layers of the first insulating material;
and
depositing at least one layer of a second insulating material layer having a second thickness, the second thickness being different than the first thickness.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/584,766Filed 2 May 2017

Published

8 Nov 2018

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10W 44/501
Electrical arrangements for controlling or matching impedance: inductive arrangements
H01F 17/0013
Printed inductances: with stacked layers
H01F 41/046
Printed circuit coils: structurally combined with ferromagnetic material
H10W 20/497
Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes: inductive…

Magnetic inductor stack including insulating material having multiple thicknesses

Life of this patent

Magnetic inductor stack including insulating material having multiple thicknesses

Life of this patent

Abstract

Claims20