Breakable substrate for semiconductor die

A device comprising:

• a substrate;
• a conductive pad extending through the substrate, wherein an exposed surface area of the conductive pad on a first side of the substrate is greater than an exposed surface area of the conductive pad on a second side of the substrate, wherein the substrate is coupled to the conductive pad at an interface and the substrate extends laterally from the interface to define a substrate extension;
• a semiconductor die mounted on the first side of the substrate and electrically connected to the conductive pad;
• and
• an outer conductive element positioned on a first side of the substrate extension,
• wherein the substrate extension defines a recess that is positioned between the semiconductor die and the outer conductive element, wherein the device includes a first breakpoint at the interface and a second breakpoint at the recess, wherein each breakpoint of the first breakpoint and the second breakpoint defines a torque tolerance that is less than a torque tolerance of the device at other points, and wherein the device is configured to break at the first breakpoint or the second breakpoint in response to force being applied to the substrate extension on the first side of the substrate.