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US 2018/0323154 A1Published application
Electronic device and manufacturing method thereof
AssigneeRealtek Semiconductor Corp.
InventorsHsiao-Tsung YEN, Yuh-Sheng JEAN, Ta-Hsun YEH
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Abstract
An electronic device includes a first semiconductor die, a plurality of bumps, and a substrate. The first semiconductor die includes a first conductive feature. The bumps are disposed on the first semiconductor die and are connected to the first conductive feature. The substrate includes a second conductive feature. The bumps are electrically connected to the second conductive feature. The first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure.
Claims15
An electronic device, comprising:
- a first semiconductor die comprising a first conductive feature;
- a plurality of bumps disposed on the first semiconductor die and connected to the first conductive feature;
- and
- a substrate comprising a second conductive feature, wherein the bumps are electrically connected to the second conductive feature, and the first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure.
1 more element
15-20. (canceled)
Dependencies are inferred from the claim text.