Multi-Stacked Package-on-Package Structures

A device comprising:

• a first die;
• a second die having a different function than the first die;
• a first encapsulant surrounding the first die and the second die;
• a first redistribution structure over the first encapsulant, the first redistribution structure being electrically connected to the second die and the first die;
• a plurality of conductive vias in electrical connection with the first redistribution structure;
• a passive device attached to the first redistribution structure with conductive connections, the passive device being adjacent the conductive vias;
• and
• a second redistribution structure over the passive device, the second redistribution structure being electrically connected to the conductive vias and the passive device.

A device comprising:

• a first die;
• a second die having a different function than the first die;
• a passive device attached to the second die with conductive connections;
• an encapsulant surrounding the passive device, the first die, and the second die;
• and
• a redistribution structure over the encapsulant, the passive device, the first die, and the second die, the passive device electrically connecting the second die to a redistribution line of the redistribution structure.