Low-dispersion component in an electronic chip
AssigneeSTMicroelectronics (Rousset) SAS
InventorsFrançois TAILLIET, Guilhem BOUTON
Life of this patent
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Abstract
A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.
Claims19
An electronic chip made by a method that comprises:
- manufacturing auxiliary correction elements on a plurality of chips, respectively, the plurality of chips containg matching components, respectively;
- for each chip, selectively activating by masking a connection of the auxiliary correction element of the chip to the matching component of the chip in accordance with a mapping of a statistical dispersion of corresponding test components of test semiconductor wafers according to positions of the corresponding test components on the test semiconductor wafers, the test components corresponding to the matching components.
A semiconductor wafer comprising electronic chips, each chip including a component of a first type and one or more auxiliary correction components associated with the component, the one or more auxiliary correction components being connected or not to the component according to a position of the chip in the wafer.
An integrated circuit chip, comprising:
- a main capacitor having first and second electrodes;
- a first correction capacitor having first and second electrodes, the first electrode of the first correction capacitor being contiguous with the first electrode of the main capacitor, and the second electrodes of the main capacitor and first correction capacitor being spaced apart from each other;
- a metallization adjacent to the main capacitor and the first correction capacitor;
- first and second terminals, the first terminal being electrically coupled to the first electrode of the main capacitor and the second terminal being electrically coupled to the metallization;
- an insulating layer on the metallization;
- a conductive main pad and conductive first and second pads on the insulating layer;
- a main conductive via extending through the insulating layer and electrically connecting the main pad to the metallization;
- and
- a first auxiliary conductive via extending through the insulating layer and electrically connecting the metallization to one of the first and second conductive pads.
Dependencies are inferred from the claim text.