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US 2018/0323140 A1Published application
Electronic device with delamination resistant wiring board
AssigneeRenesas Electronics Corporation
InventorHiroki SHIBUYA
Life of this patent
Estimating the term…
Abstract
This invention provides an electronic device with improved reliability. The electronic device has a wiring board with a back-surface ground pattern formed at the back surface of the board. The back-surface ground pattern is provided with a notch overlapping a region of an upper wiring layer at which a board member is exposed and which is encircled by a wide pattern, the notch permitting the release of water vapor from the region.
Claims5
1-15. (canceled)
An electronic device functioning as a wireless communication unit, comprising:
- a wiring board having a front surface and a back surface;
- and
- a semiconductor device mounted over the front surface of the wiring board,
- wherein the wiring board includes
- a front-surface wiring layer formed at the front surface,
- an internal wiring layer formed inside the wiring board, and
- a back-surface wiring layer formed at the back surface,
- wherein the internal wiring layer includes
- a board-member exposed region from which a board member is exposed, and
- a first internal wide pattern enclosing the board-member exposed region,
- wherein the back-surface wiring layer includes
- a back-surface wide pattern, and
- a plurality of back-surface terminal patterns formed away from and around the back-surface wide pattern,
- wherein a first region is formed between the back-surface wide pattern and a group of the back-surface terminal patterns in plan view, and the first region has a first distance between the back-surface wide pattern and the group of the back-surface terminal patterns,
- wherein a second region is formed between the back-surface wide pattern and another group of the back-surface terminal patterns in plan view, and the second region has a second distance between the back-surface wide pattern and the another group of the back-surface terminal patterns, and
- wherein the first region overlaps with the board-member exposed region in plan view.
13 more elements
An electronic device functioning as a wireless communication unit, comprising:
- a wiring board having a front surface and a back surface;
- and
- a semiconductor device mounted over the front surface of the wiring board,
- wherein the wiring board includes
- a front-surface wiring layer formed at the front surface,
- an internal wiring layer formed inside the wiring board, and
- a back-surface wiring layer formed at the back surface,
- wherein the internal wiring layer includes
- a board-member exposed region from which the board member is exposed, and
- an internal wide pattern divided into a plurality of parts by the board-member exposed region, and
- wherein the board-member exposed region is connected to a side surface of the wiring board.
8 more elements
Dependencies are inferred from the claim text.