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AssigneeGemalto SA
InventorsLine Degeilh, Remy Janvrin, Lucile Dossetto, Alain Le Loc'h, Jean-Christophe Fidalgo
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The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.
A method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material,
A device with a secure integrated-circuit chip, said device comprising an insulating substrate, electrically conductive surfaces on the substrate connected or coupled to said electronic chip said electrically conductive surfaces comprising conductive material,
Dependencies are inferred from the claim text.