Redundant through-hole interconnect structures

A device comprising:

• a core including a substrate having formed therein a first through-hole and a second through-hole each extending from a first side of the substrate to a second side of the substrate, wherein an insulator is disposed between the first through-hole and the second through-hole in the substrate;
• a first through-hole interconnect disposed in the first through-hole;
• a second through-hole interconnect disposed in the second through-hole;
• a first interconnect structure to provide a short between the first through-hole interconnect and the second through-hole interconnect at the first side;
• and
• a second interconnect structure to provide a short between the first through-hole interconnect and the second through-hole interconnect at the second side;
• wherein a total volume of the first through-hole is equal to or less than twenty million (20·106) cubic micrometers (μm3), and wherein a total volume of any voids formed by the first through-hole interconnect is equal to or more than 6·103 μm3.

A method comprising:

• forming a first through-hole and a second through-hole each extending from a first side of a substrate to a second side of the substrate, wherein an insulator is disposed between the first through-hole and the second through-hole in the substrate;
• depositing a first conductor in the first through-hole;
• depositing a second conductor in the second through-hole;
• forming a first short between the first conductor and the second conductor at the first side;
• and
• forming a second short between the first conductor and the second conductor at the second side;
• wherein a total volume of the first through-hole is equal to or less than twenty million (20·106) cubic micrometers (μm3), and wherein a total volume of any voids formed by the first through-hole interconnect is equal to or more than 6·103 μm3.

A system comprising:

• a packaged device including:
• one or more integrated circuit (IC) chips;
• a core including a substrate coupled to the one or more IC chips, the having formed therein a first through-hole and a second through-hole each extending from a first side of the substrate to a second side of the substrate, wherein an insulator is disposed between the first through-hole and the second through-hole in the substrate;
• a first through-hole interconnect disposed in the first through-hole;
• a second through-hole interconnect disposed in the second through-hole;
• a first interconnect structure to provide a short between the first through-hole interconnect and the second through-hole interconnect at the first side;
• and
• a second interconnect structure to provide a short between the first through-hole interconnect and the second through-hole interconnect at the second side;
• wherein a total volume of the first through-hole is equal to or less than twenty million (20·106) cubic micrometers (μm3), and wherein a total volume of any voids formed by the first through-hole interconnect is equal to or more than 6·103 μm3;
• and
• a display device coupled to the packaged device, the display device to display an image based on signals exchanged with the one or more IC chips.