Distribution and stabilization of fluid flow for interlayer chip cooling

A two-phase method for cooling semiconductor structures in a chip stack comprising:

• forming first non-metallic pillars on a first surface of a first semiconductor structure;
• forming second non-metallic pillars on a top surface of a second semiconductor structure;
• positioning the second semiconductor structure directly above the first semiconductor structure and joining ends of the first non-metallic pillars to ends of the second non-metallic pillars;
• and
• forming a fluid channel between the first surface of the first semiconductor structure and the first surface of the second semiconductor structure through the joined non-metallic pillars, the fluid channel comprising two substantially vertical channel walls.