Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system

A power electronics assembly comprising:

• a substrate layer having a substrate fluid inlet and a substrate fluid outlet;
• and
• a plurality of semiconductor device stacks, wherein each semiconductor device stack comprises:
• a first semiconductor cooling chip coupled to a second semiconductor cooling chip, wherein the first and second semiconductor cooling chips each comprise:
• a semiconductor material;
• a cooling chip fluid inlet;
• a cooling chip fluid outlet;
• and
• one or more cooling chip fluid inlet channels positioned in a recessed region of the semiconductor cooling chips and in fluid communication with the cooling chip fluid inlet and the cooling chip fluid outlet;
• a wide bandgap semiconductor device positioned between and thermally coupled to the first and second semiconductor cooling chips;
• a first electrode electrically and thermally coupled to the wide bandgap semiconductor device and positioned between the first semiconductor cooling chip and the wide bandgap semiconductor device;
• and
• a second electrode electrically and thermally coupled to the wide bandgap semiconductor device and positioned between the second semiconductor cooling chip and the wide bandgap semiconductor device;
• wherein:
• the cooling chip fluid inlets of each semiconductor device stack are fluidly coupled to the substrate fluid inlet of the substrate layer;
• and
• the cooling chip fluid outlet of each semiconductor device stack are fluidly coupled to the substrate fluid outlet of the substrate layer.