Semiconductor package having routable encapsulated conductive substrate and method

A semiconductor device structure comprising:

• a routable encapsulated conductive substrate comprising:
• a first conductive structure encapsulated within a first laminated layer, wherein:
• the first conductive structure comprises:
• a first surface finish structure;
• and
• first conductive vias connected to at least a portion of the first surface finish structure;
• and
• the first laminated layer defines a top substrate surface of the routable encapsulated conductive substrate;
• the first surface finish structure is exposed by the top substrate surface;
• a second conductive structure electrically coupled to the first conductive vias and encapsulated within a second laminated layer, wherein:
• the second conductive structure comprises:
• a conductive pattern structure;
• and
• conductive pads connected to the conductive pattern structure;
• and
• the second laminated layer defines a bottom substrate surface of the routable encapsulated conductive substrate;
• the second laminated layer covers a portion of the first laminated layer;
• and
• lower surfaces of the conductive pads proximate to the bottom substrate surface are devoid of the second laminated layer so that the lower surfaces are adapted for coupling to a next level assembly;
• a semiconductor device electrically coupled to the first surface finish structure;
• and
• a package body covering the semiconductor device, at least portions of the first surface finish structure, and at least portions of the top substrate surface, wherein:
• the first surface finish structure and the first conductive vias comprise different conductive materials.

A method of manufacturing a semiconductor device having a routable encapsulated conductive substrate comprising:

• providing a routable encapsulated conductive substrate comprising:
• a first conductive structure encapsulated within a first laminated layer, wherein:
• the first conductive structure comprises:
• a first surface finish structure;
• and
• first conductive vias connected to at least a portion of the first surface finish structure;
• and
• the first laminated layer defines a top substrate surface of the routable encapsulated conductive substrate;
• the first surface finish structure is exposed by the top substrate surface;
• a second conductive structure electrically coupled to the first conductive vias and encapsulated within a second laminated layer, wherein:
• the second conductive structure comprises:
• a conductive pattern structure;
• and
• conductive pads connected to the conductive pattern structure;
• and
• the second laminated layer defines a bottom substrate surface of the routable encapsulated conductive substrate;
• the second laminated layer covers a portion of the first laminated layer;
• and
• lower surfaces of the conductive pads proximate to the bottom substrate surface are devoid of the second laminated layer so that the lower surfaces are adapted for coupling to a next level assembly;
• electrically coupling a semiconductor device to the first surface finish structure;
• and
• providing a package body covering the semiconductor device, at least portions of the first surface finish structure, and at least portions of the top substrate surface, wherein:
• the first surface finish structure and the first conductive vias comprise different conductive materials.