Stacked fan-out package structure

A semiconductor package structure, comprising:

• a first semiconductor die having a first surface and a second surface opposite thereto;
• a film disposed on the first surface of the first semiconductor die via an adhesion layer;
• a first molding compound surrounding the first semiconductor die and in contact with the film;
• a first redistribution layer (RDL) structure disposed on the second surface of the first semiconductor die and laterally extending on the first molding compound;
• a second semiconductor die disposed on the first RDL structure and having a first surface and a second surface opposite thereto;
• a second molding compound surrounding the second semiconductor die and in contact with the film;
• and
• a third semiconductor die disposed on the second RDL structure and having a first surface and a second surface opposite thereto;
• a third molding compound surrounding the third semiconductor die and in contact with the film.