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US 2018/0323126 A1Published application
Package structure
AssigneeInnolux Corporation
InventorsYi-Hung Lin, Chien-Chang Lu, Cheng-I Wu, Li-Wei Sung, Cheng-Chi Wang, Chin-Lung Ting
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Abstract
The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.
Claims20
A package structure, comprising:
- a redistribution layer comprising:
- a switch circuit portion comprising a transistor;
- and
- a redistribution portion adjacent to the switch circuit portion;
- and
- a die overlapping the redistribution portion,
- wherein the transistor is electrically connected to the die.
4 more elements
A package structure, comprising:
- a die comprising a plurality of die ends, wherein the die ends comprise a first die end and a second die end;
- a first transistor comprising a switch control end, a first end and a second end, wherein the first end of the first transistor is electrically connected to the first die end;
- a second transistor comprising a switch control end, a first end and a second end, wherein the first end of the second transistor is electrically connected to the second die end;
- a first control node electrically connected to the switch control end of the first transistor;
- a second control node electrically connected to the switch control end of the second transistor;
- and
- at least one input and output end comprising a first input and output end, wherein the first input and output end is electrically connected to the second end of the first transistor and the second end of the second transistor.
4 more elements
Dependencies are inferred from the claim text.